产品规格:
- 板材: FR4
- 层数: 6 层
- 板厚: 1.1mm
- 完成铜厚: 1.0 oz
- 表面处理: 沉金
- 应用: 咖啡机
制程能力:
Hole position tolerance ( compared with CAD data ) |
0.256"(6.5mm) |
Drill hole diameter (min.) |
0.0079"(0.2mm) |
Finish hole size (min.) |
0.0059"(0.15mm) |
Slot width (min.) |
Drilling:0.5mm Routing:0.7mm Punching:0.9mm |
Half a hole (min.) |
0.5mm |
Finish hole size tolerance |
PTH:±2mil (±0.05mm) NPTH:±1.5mil (±0.038mm) Slot: W±3mil (±0.076mm) L±3mil (±0.1mm) |
Hole position tolerance ( compared with CAD data ) |
±2mil (±0.05mm) |
Space of hole to hole (min.) |
Drilling: 0.15mm Routing:0.3mm Punching:1.2mm |
Space of drill hole to board edge (min.) |
V-CUT: 0.4mm Routing:0.4mm Punching:1.2mm |
Hole roughness (max.) |
1.0mil |
Copper thickness for PTH wall (PTH) |
Min:1200u″,AVG:780u″ |
Aspect ratio of PTH (max.) |
8 : 1 |
Outer layer design trace width/space (min.) |
H/H OZ:3/3.5mil (0.076/0.089mm) 1/1 OZ:6/6mil (0.15/0.15mm) 2/2 OZ:10/10mil (0.25/0.25mm) 3/3 OZ:13/13mil (0.32/0.32mm) |
Inner layer design trace width/space (min.) |
H/H OZ: 3.5/3.5mil (0.085/0.085mm) 1/1 OZ:5/5mil (0.1/0.1mm) 2/2 OZ:8/8mil (0.2/0.2mm) |
Annular ring design of outer layer (min.) |
≤90° break out:4.0mil No break out:5.0mil Ring≥1mil:6.0mil |
Annular ring design of inner layer (min.) |
No break out:3.5mil Ring≥1mil:4.5mil |
Space of hole to gound ( clearance ) (min.) |
Inner layer:6mil (0.15mm) Outer layer: 6mil (0.15mm) |
电路板制作流程图: