产品规格:
- Material: FR4 PCB
- Layer count: 4 layers
- Board thickness: 1.6mm
- Finish copper thickness: 1.0 oz
- Surface treatment: ENIG ( Immersion Gold )
- Application: Medical equipment
制程能力:
|
Tenting |
Hole：≤5.5mm, Slot：≤4*6.5mm |
|
SMD Pad width/space (min.) |
Width：7mil（0.18mm), Space：8mil（0.20mm) |
|
Space of trace to board
edge & trace to V-cut (min.) |
Trace to board edge: 6mil (0.15mm) Trace to V-cut: 12mil (0.3mm) |
|
Tolerance after etching |
4mil≤W≤12mil:±20%, W＞12mil:±12% |
|
Impedance tolerance |
≥50ohm±8%;＜50ohm±5ohm |
|
Hole to hole position
tolerance (min.) |
±2mil (0.05mm) |
|
Image to image tolerance
(min.) |
±3mil (0.076mm) |
|
Image to hole tolerance of
outer layer (min.) |
±3mil (0.076mm) |
|
Image to board edge
tolerance of outer layer (min.) |
±3mil (0.076mm) |
|
Hole to board edge position
tolerance (min.) |
±4mil (0.1mm) |
|
Solder mask registration
(min.) |
±1.5mil (0.038mm) |
|
Solder mask thickness
(min.) |
Edge of trace：0.2mil (5um) Top of trace：0.4mil (10um) |
|
Solder Dam width (min.) |
1.5mil (0.038mm) |
|
Space of solder mask
opening to trace (min.) |
2.5mil (0.068mm) |
|
Solder mask pluging drill
hole diameter |
0.6mm |
|
Line width of etching
(min.) |
Dot：10mil (0.25mm) Line：8mil (0.20mm) |
|
Line width out etching
(min.) |
6mil (0.15mm) |
|
Letter line width of green
solder mask (min.) |
Dot：6mil (0.15mm) Line：6mil (0.15mm) |
|
Opening legend line width of green solder mask (min.) |
Dot：HASL：15mil（0.38mm） Others：10mil (0.25mm) Line：HASL：10mil (0.25mm) Others：8mil (0.2mm) |
|
Opening line width of green
solder mask (min.) |
10mil (0.25mm) |
|
Width from wet film to bare
copper (min.) |
Inkjet: 6mil (0.15mm) |
|
Height of legend |
30mil (0.76mm) (Only for silk screen) |
|
Space between legend
(disconnect) (min.) |
Inkjet: 6mil (0.15mm) |
|
Line width of silkscreen
legend |
4.0mil (0.1mm) |
|
Space between legend and
Pad (min.) |
6mil (0.15mm) |
|
Space between legend and
board edge (min.) |
6mil (0.15mm) |
|
Space between legend and
V-cut (min.) |
10mil (0.25mm) |
电路板制作流程图:
