产品规格:
- Material: FR4 PCB
- Layer count: 8 layers
- Board thickness: 1.6mm
- Finish copper thickness: 1.0 oz
- Surface treatment: LF HASL
- Application: Industrial control
制程能力:
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BGA PAD design (general) |
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BGA Pad size(min.):9.8mil H.A.S.L(min.):12mil |
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BGA PAD design (general) |
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电路板制作流程图:
